Please use this identifier to cite or link to this item: http://hdl.handle.net/2381/10002
Title: Dielectric spectroscopy study of thermally-aged extruded model power cables
Authors: Liu, Tong
Fothergill, John C.
Dodd, Stephen J.
Dissado, Len A.
Nilsson, Ulf H.
Fu, Mingli
Perrot, Fabrice
First Published: 2010
Presented at: 10th IEEE International Conference on Solid Dielectrics (ICSD), Postdam, Germany
Start Date: 4-Jul-2010
Publisher: IEEE
Citation: Proceedings of the 10th IEEE International Conference on Solid Dielectrics (ICSD), 2010, pp. 16-19
Abstract: “Model” extruded power cables, having a much reduced geometry but using the same extrusion techniques and materials as full-sized cables, have been examined using dielectric spectroscopy techniques to study their thermal ageing effects. Cables insulated with homo-polymer XLPE and co-polymer of XLPE with micron-sized ethylene-butyl-acrylate (EBA) islands were studied by both frequency-domain and time-domain dielectric spectroscopy techniques after accelerated thermal ageing under 135°C for 60 days. In the frequency domain, a frequency response analyzer (FRA) was used to measure the frequency range from 10-4Hz to 1Hz at temperatures from 20°C to 80°C. In the time domain, a special charging/discharging current measurement system was developed to measure the frequencies from 10-1Hz to 102Hz. These techniques were chosen to cope with the extremely low dielectric losses of the model cables. The results are compared with those from new model power cables that were degassed at 80°C for 5 days. Thermal ageing was found to increase the low-frequency conductivity, permittivity and the discharging current. Both homo- and co-polymer cables have substantial increase of dielectric loss after ageing.
DOI Link: 10.1109/ICSD.2010.5568077
ISSN: 978-1-4244-7943-6 (Online)
ISBN: 978-1-4244-7945-0 (Print)
Links: http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?asf_arn=null&asf_iid=null&asf_pun=5559271&asf_in=null&asf_rpp=null&asf_iv=null&asf_sp=null&asf_pn=1
http://hdl.handle.net/2381/10002
Version: Post-print
Status: Peer-reviewed
Type: Conference Paper
Rights: Copyright © 2010 IEEE.
Appears in Collections:Conference Papers & Presentations, Dept. of Engineering

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