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Title: Statistical Analysis of Partial Discharges from Electrical Trees Grown in a Flexible Epoxy Resin
Authors: Dodd, Stephen J.
Chalashkanov, Nikola M.
Fothergill, John C.
First Published: 26-Oct-2008
Presented at: IEEE Conference on Electrical Insulation and Dielectric Phenomena, Quebec City, Canada
Start Date: 26-Oct-2008
End Date: 29-Oct-2008
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Citation: Electrical Insulation and Dielectric Phenomena, 2008, CEIDP 2008, Annual Report Conference on, pp. 300-303.
Abstract: Electrical treeing is a long-term degradation mechanism in polymeric insulation, which can lead to electrical failure of HV insulation systems. The rate at which trees grow across the insulation depends on the PD activity occurring within them and hence the detection of the onset of electrical treeing could be established by PD monitoring. In this paper, a statistical analysis of the partial discharges detected during the growth of trees in an epoxy resin will be reported. The aim of this work was to provide additional insight into the physical mechanisms that lead to the observed fluctuations in the partial discharge activity. The results demonstrate interesting correlations between a number of statistical parameters, such as average discharge magnitude and standard deviation in the partial discharge amplitudes. These correlations could also be related to physical parameters such as the applied voltage magnitude and the measured power dissipation due to the partial discharges occurring during tree growth. The implications of this work for deterministic methodologies for the simulation of tree growth as well as for condition monitoring using feature recognition strategies for the early detection of tree growth will be discussed.
DOI Link: 10.1109/CEIDP.2008.4772838
ISBN: 978-1-4244-2548-8
Version: Post-print
Status: Peer-reviewed
Type: Conference Paper
Rights: © 2008 IEEE. Deposited with reference to the publisher's archiving policy available on the SHERPA/RoMEO website. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Appears in Collections:Conference Papers & Presentations, Dept. of Engineering

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