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|Title:||Characterizing HV XLPE cables by electrical, chemical and microstructural measurements on cable peeling: effects of surface roughness, thermal treatment and peeling location|
|Authors:||Dissado, Len A.|
Fothergill, John C.
Stevens, G. C.
Nilsson, U. H.
Montanari, G. C.
|Presented at:||69th Annual Conference on Electrical Insulation and Dielectric Phenomena, 15-18 October 2000, Victoria, Canada.|
|Publisher:||Institute of Electrical and Electronics Engineers (IEEE)|
|Citation:||Electrical Insulation and Dielectric Phenomena, 2000, Annual Report, Conference on, Vol. 1, pp. 136-140.|
|Abstract:||Characterization of the electrical, chemical, and microstructural properties of high voltage cables was the first step of the European project “ARTEMIS”, which has the aim of investigating degradation processes and constructing aging models for the diagnosis of cross-linked polyethylene (XLPE) cables. Cables produced by two different manufacturers were subjected to a large number of electrical, microstructural, and chemical characterizations, using cable peelings, instead of lengths of whole cables, as specimens for the measurements. Here the effect of surface deformation and roughness due to peeling and the relevance and significance of thermal pre-treatment prior to electrical and other measurements is discussed. Special emphasis is put on space charge, conduction current and luminescence measurements. We also consider the dependence of these properties on the spatial position of the specimen within the cable. It is shown that even though the two faces of the cable peel specimens have different roughness, the low-field electrical properties seem quite insensitive to surface roughness, while significant differences are detectable at high fields. Thermal pre-treatment is required to stabilize the insulating material to enable us to obtain reproducible results and reliable inter-comparisons throughout the whole project. The spatial position of the specimens along the cable radius can also have a non-negligible influence on the measured properties, due to differential microstructure and chemical composition.|
|Rights:||Copyright © 2000 IEEE. Deposited with reference to the publisher's archiving policy available on the SHERPA/RoMEO website. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.|
|Appears in Collections:||Conference Papers & Presentations, Dept. of Engineering|
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