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Title: Influence of the Temperature on the Dielectric Properties of Epoxy Resins
Authors: Dodd, Stephen J.
Chalashkanov, Nikola M.
Fothergill, John C.
Dissado, Len A.
First Published: Jul-2010
Presented at: International Conference on Solid Dielectrics ICSD, University of Potsdam, Potsdam, Germany, 4-9 July 2010.
Start Date: 4-Jul-2010
End Date: 9-Jul-2010
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Citation: Solid Dielectrics (ICSD), 2010, 10th IEEE International Conference on, Proceedings of, pp. 1-4.
Abstract: Electrical degradation processes in epoxy resins, such as electrical treeing, were found to be dependent on the temperature at which the experiments were carried out. Therefore, it is of considerable research interest to study the influence of temperature on the dielectric properties of the polymers and to relate the effect of temperature on these properties to the possible electrical degradation mechanisms. In this work, the dielectric properties of two different epoxy resin systems have been characterized via dielectric spectroscopy. The epoxy resins used were bisphenol-A epoxy resins Araldite CY1301 and Araldite CY1311, the later being a modified version of the former with added plasticizer. The CY1301 samples were tested below and above their glass transition temperature, while the CY1311 were tested well above it. Both epoxy systems possess similar behaviour above the glass transition temperature, e.g. in a flexible state, which can be characterized as a low frequency dispersion (LFD). On the other hand, it was found that below the glass transition temperature CY1301 samples have almost “flat” dielectric response in the frequency range considered. The influence of possible interfacial features on the measured results is discussed.
DOI Link: 10.1109/ICSD.2010.5567945
ISSN: 1553-5282
ISBN: 978-1-4244-7944-3
Version: Post-print
Status: Peer-reviewed
Type: Conference Paper
Rights: Copyright © 2010 IEEE. Deposited with reference to the publisher's archiving policy available on the SHERPA/RoMEO website. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
Appears in Collections:Conference Papers & Presentations, Dept. of Engineering

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