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Please use this identifier to cite or link to this item: http://hdl.handle.net/2381/10332

Title: Effect of side chains on the dielectric properties of alkyl esters derived from palm kernel oil
Authors: Abdelmalik, AA
Fothergill, John C.
Dodd, Steve J
Abbott, Andrew P
Harris, RC
Issue Date: 2011
Presented at: Trondheim, Norway
Start Date:  26
End Date:  30
Publisher: IEEE
Citation: Proceedings of the IEEE International Conference on Dielectric Liquids, 2011.
Abstract: Alkyl ester derivatives were synthesized from laboratory purified palm kernel oil. The steps in the synthesis involved transesterification of palm kernel oil to produce a methyl ester, followed by epoxidation and then the grafting of side chains by esterification with propionic and butyric anhydride. The dielectric and thermal properties of the ester derivatives were analyzed and compared with the methyl ester. The melting point of the ester derivatives were found to reduce with side chain attachment and antioxidant improved its thermal stability. The dielectric loss was dominated by mobile charged particles and the chemical modification appeared to increase the rate at which electric double layer was formed at the electrode-liquid interface. The esters possessed excellent breakdown strengths suggesting that the processing to optimize their physical properties did not have a negative influence on their electrical breakdown strength. This product may prove useful as an insulation fluid in Electrical Power Transformers.
DOI Link: 10.1109/ICDL.2011.6015413
ISSN: 2153-3725
ISBN: 978-1-4244-7355-7
eISSN: 2153-3733
Links: http://ieeexplore.ieee.org/xpl/mostRecentIssu(...)
http://hdl.handle.net/2381/10332
Version: Post-print
Status: Peer-reviewed
Type: Conference Paper
Rights: Copyright © 2011 IEEE. Reprinted with permission from the authors and IEEE.
This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Leicester's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
Appears in Collections:Conference Papers & Presentations, Dept. of Engineering

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