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Title: The electrodeposition of silver composites using deep eutectic solvents.
Authors: Abbott, AP
El Ttaib K
Frisch, G
Ryder, KS
Weston, D
First Published: 21-Feb-2012
Citation: PHYS CHEM CHEM PHYS, 2012, 14 (7), pp. 2443-2449
Abstract: Silver is an important metal for electronic connectors, however, it is extremely soft and wear can be a significant issue. This paper describes how improved wear resistant silver coatings can be obtained from the electrolytic deposition of silver from a solution of AgCl in an ethylene glycol/choline chloride based Deep Eutectic Solvent. An up to 10-fold decrease in the wear volume is observed by the incorporation of SiC or Al(2)O(3) particles. The work also addresses the fundamental aspect of speciation of silver chloride in solution using EXAFS to probe solution structure. The size but not the nature of the composite particles is seen to change the morphology and grain size of the silver deposit. Grain sizes are shown to be consistent with previous nucleation studies. The addition of LiF is found to significantly affect the deposit morphology and improve wear resistance.
DOI Link: 10.1039/c2cp23712a
eISSN: 1463-9084
Type: Journal Article
Appears in Collections:Published Articles, Dept. of Chemistry

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