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|Title:||Inhibited coarsening of a sprayformed and extruded hypereutectic aluminium-silicon alloy in the semi-solid state|
|Authors:||Hogg, S. C.|
Atkinson, Helen V.
|Publisher:||Springer Verlag on behalf of ASM International|
|Citation:||Metallurgical and Materials Transactions A, 2005, 36A (1), pp. 149-159|
|Abstract:||The microstructural evolution of a sprayformed and extruded hypereutectic aluminium-30% silicon-5% copper-2% magnesium alloy heated into the semi-solid state has been investigated. Liquid is formed initially by a quaternary eutectic reaction and then by a ternary melt reaction. These reactions occur relatively quickly. However, the binary Al-Si eutectic melt reaction takes a significant time – around several hours depending on the temperature. The coarsening rate constants (K) for the growth of the silicon particles are approximately 3 to 4 orders of magnitude lower than those for the majority of metal sprayformed alloys. This may be associated with difficulties in addition or removal of atoms from the low index silicon facets. Where growth does occur, agglomeration of silicon particles may play a large role, especially at higher liquid contents. Electron backscatter diffraction (EBSD) gives evidence of agglomeration, and furthermore shows that high angle silicon-silicon boundaries are not wetted with liquid.|
|Rights:||Copyright 2005 ASM International. This paper was published in Metallurgical and Materials Transactions A, 2005, 36A (1), pp. 149-159 and is made
available as an electronic reprint with the permission of ASM International. One print or electronic copy may
be made for personal use only. Systematic or multiple reproduction, distribution to multiple locations via
electronic or other means, duplications of any material in this paper for a fee or for commercial purposes, or
modification of the content of this paper are prohibited.|
This is the author’s final draft of the paper published as Metallurgical and Materials Transactions A, 2005, 36A (1), pp. 149-159. The original publication is available at www.springerlink.com, Doi: 10.1007/s11661-005-0147-7.
|Appears in Collections:||Published Articles, Dept. of Engineering|
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