Please use this identifier to cite or link to this item: http://hdl.handle.net/2381/27678
Title: Partial Discharge Patterns in Conducting and Non-Conducting Electrical Trees
Authors: Dodd, Stephen J.
Chalashkanov, Nikola M.
Fothergill, John C.
First Published: 2010
Presented at: International Conference on Solid Dielectrics ICSD, Univ Potsdam, Potsdam, GERMANY
Start Date: 4-Jul-2010
End Date: 9-Jul-2010
Publisher: IEEE
Citation: Proceedings of the 2010 IEEE International Conference on Solid Dielectrics (ICSD 2010), 2010.
Abstract: Previous observations on electrical tree growth in epoxy resins has shown that different types of tree growth structure, electrically conducting and non-conducting, can occur dependent on the state, glassy or flexible, of the epoxy resin. In this current study, the partial discharge characteristics were characterized experimentally at a temperature of 20 degrees C within two different epoxy resins systems having glass transition temperatures of 0 degrees C and 50 degrees C. The partial discharge activity (determined from apparent charge measurements) was characterized in terms of phi similar to q similar to n patterns using statistical tools. The aim was to compare the apparent charge measurements obtained from conducting and non-conducting electrical tree structures with computer simulations of the partial discharge activity in both conducting and non-conducting electrical trees. The results show that there is a significant relationship between the local extent of the partial discharge phenomena, as determined by the conductivity of the tree channels, and the apparent charge, as shown by the experimental and simulated partial discharge patterns. The implications of this work for partial discharge detection as well as for condition monitoring in real insulating systems are discussed.
DOI Link: 10.1109/ICSD.2010.5568217
ISSN: 1553-5282
ISBN: 978-1-4244-7944-3
Links: http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5568217
http://hdl.handle.net/2381/27678
Version: Post-print
Type: Conference Paper
Rights: Copyright © 2010 IEEE. Deposited with reference to the publisher’s archiving policy available on the SHERPA/RoMEO website
Description: Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.
Appears in Collections:Conference Papers & Presentations, Dept. of Engineering

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