Please use this identifier to cite or link to this item:
Title: Multi-Objective Design of IGBT Power Modules Considering Power Cycling and Thermal Cycling
Authors: Ji, Bing
Song, X.
Sciberras, E.
Cao, W.
Hu, Y.
Pickert, V.
First Published: 28-Oct-2014
Publisher: Institute of Electrical and Electronics Engineers (IEEE), United States
Citation: IEEE Transactions on Power Electronics, 2015, 30(5), pp. 2493-2504
Abstract: Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.
DOI Link: 10.1109/TPEL.2014.2365531
ISSN: 0885-8993
Version: Publisher Version
Status: Peer-reviewed
Type: Journal Article
Rights: Copyright © 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. See standards/publications/rights/index.html for more information.
Appears in Collections:Published Articles, Dept. of Engineering

Files in This Item:
File Description SizeFormat 
06937146.pdfPublished (publisher PDF)917.19 kBAdobe PDFView/Open

Items in LRA are protected by copyright, with all rights reserved, unless otherwise indicated.