Please use this identifier to cite or link to this item: http://hdl.handle.net/2381/37121
Title: In situ diagnostics and prognostics of wire bonding faults in IGBT modules for electric vehicle drives
Authors: Ji, Bing
Cao, W.
Zahawi, B.
Pickert, V.
First Published: 13-Mar-2013
Publisher: Institute of Electrical and Electronics Engineers (IEEE), United States
Citation: IEEE Transactions on Power Electronics, 2013, 28 (12), pp. 5568-5577
Abstract: This paper presents a diagnostic and prognostic condition monitoring method for insulated-gate bipolar transistor (IGBT) power modules for use primarily in electric vehicle applications. The wire-bond-related failure, one of the most commonly observed packaging failures, is investigated by analytical and experimental methods using the on-state voltage drop as a failure indicator. A sophisticated test bench is developed to generate and apply the required current/power pulses to the device under test. The proposed method is capable of detecting small changes in the failure indicators of the IGBTs and freewheeling diodes and its effectiveness is validated experimentally. The novelty of the work lies in the accurate online testing capacity for diagnostics and prognostics of the power module with a focus on the wire bonding faults, by injecting external currents into the power unit during the idle time. Test results show that the IGBT may sustain a loss of half the bond wires before the impending fault becomes catastrophic. The measurement circuitry can be embedded in the IGBT drive circuits and the measurements can be performed in situ when the electric vehicle stops in stop-and-go, red light traffic conditions, or during routine servicing.
DOI Link: 10.1109/TPEL.2013.2251358
ISSN: 0885-8993
Links: http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6479354
http://hdl.handle.net/2381/37121
Version: Post-print
Status: Peer-reviewed
Type: Journal Article
Rights: Copyright © 2013 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Appears in Collections:Published Articles, Dept. of Engineering

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