Please use this identifier to cite or link to this item: http://hdl.handle.net/2381/37454
Title: A Fast and Scalable Fault Injection Framework to Evaluate Multi/Many-core Soft Error Reliability
Authors: Rosa, Felipe R.
Kastensmidt, Fernanda
Reis, Ricardo
Ost, Luciano
First Published: 14-Oct-2015
Presented at: IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFTS), 12-14 Oct. 2015, Amherst, MA .
Start Date: 12-Oct-2015
End Date: 14-Oct-2015
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Citation: 2015 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFTS), Proceedings of., 2015, pp. 211-214
Abstract: Increasing chip power densities allied to the continuous technology shrink is making emerging multiprocessor embedded systems more vulnerable to soft errors. Due the high cost and design time inherent to board-based fault injection approaches, more appropriate and efficient simulation-based fault injection frameworks become crucial to guarantee the adequate design exploration support at early design phase. In this scenario, this paper proposes a fast and flexible fault injector framework, called OVPSim-FIM, which supports parallel simulation to boost up the fault injection process. Aiming at validating OVPSim-FIM, several fault injection campaigns were performed in ARM processors, considering a market leading RTOS and benchmarks with up to 10 billions of object code instructions. Results have shown that OVPSim-FIM enables to inject faults at speed of up to 10,000 MIPS, depending on the processor and the benchmark profile, enabling to identify erros and exceptions according to different criteria and classifications.
DOI Link: 10.1109/DFT.2015.7315164
ISSN: 1550-5774
Links: http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7315164
http://hdl.handle.net/2381/37454
Version: Post-print
Status: Peer-reviewed
Type: Conference Paper
Rights: Copyright © IEEE, 2015. The version of the article associated with this record is distributed under the terms of the Creative Commons Attribution-Non Commercial-No Derivatives License (http://creativecommons.org/licenses/by-nc-nd/4.0/ ), which permits use and distribution in any medium, provided the original work is properly cited, the use is non-commercial and no modifications or adaptations are made.
Appears in Collections:Conference Papers & Presentations, Dept. of Engineering

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