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Title: Temperature dependence of charge packet velocity in XLPE cable peelings
Authors: Dissado, Len A.
Zadeh, S.
Fothergill, John C.
See, A.
First Published: Oct-2007
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Citation: IEEE Conference on Electrical Insulation and Dielectric Phenomena, 2007 - Annual Report, pp. 425-428.
Abstract: The generation and transit of charge packets in 150μm thick peelings from the insulation of Medium Voltage Cables manufactured using the same XLPE batch have been investigated at a number of different temperatures. Charge packet motion was investigated in peelings taken from cables that have been electro-thermally stressed at T= 90 degrees C for 5000 hours with a Laplacian field E ≈ 20kV/mm at the location of the samples. It was found that charge packets were generated by an applied field of 120kV/mm when the internal space charge field reached 140-150kV/mm. Measurements were made in three controlled temperature environments and it was found that the transit time fitted an Arrhenius behaviour with an activation energy of ~1.2 eV. This value is similar to estimates made for the deepest traps (>1.1eV) made from the decay of space charge accumulated at lower fields of 46.67kVmm. It is also close to the activation energy for the conductivity (~1.25 eV) obtained from the dielectric spectroscopy of unpeeled cable sections at Erms ≈ 0.41 V/mm, and ~1.15eV from the dielectric spectroscopy of the peelings (E = 40V/mm). It is therefore concluded that the transit of the charge packet is associated with the trap-to-trap transport of charge carriers located in the deepest traps available. The implications of these results for the mechanism of charge packet generation is discussed.
DOI Link: 10.1109/CEIDP.2007.4451552
ISBN: 1424414814
Type: Conference paper
Rights: This is the author's final draft of the paper published as IEEE Conference on Electrical Insulation and Dielectric Phenomena, 2007 - Annual Report, pp. 425-428. Copyright © 2007 IEEE. The final version is available from Doi: 10.1109/CEIDP.2007.4451552. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Leicester’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
Appears in Collections:Conference Papers & Presentations, Dept. of Engineering

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