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|Title:||A 'Water Shell' Model for the Dielectric Properties of Hydrated Silica-filled Epoxy Nano-composites|
Fothergill, John C.
Rowe, Stephen W.
|Publisher:||Institute of Electrical and Electronics Engineers (IEEE)|
|Citation:||IEEE International Conference on Solid Dielectrics, 2007 - Proceedings of, pp. 389-392.|
|Abstract:||The electrical properties of epoxy resin have been studied as a function of hydration. The epoxy was studied in an un-filled state, filled with 40 µm SiO2 particles, and filled with 50 nm SiO2 particles. The relative humidity was controlled by saturated salt solutions at ambient temperatures from 298-353 K. Measurements were made using dielectric spectroscopy over the frequency range 10-3-105 Hz. The hydration isotherm (i.e. the mass uptake of water) was established by measuring the mass as a function of relative humidity (RH). It was found that the nanocomposites absorb up to 60% more water than the unfilled and micro-filled epoxies. Dielectric spectroscopy shows different conduction and quasi-DC behaviours at very low frequencies (<10-2 Hz) with activation energies dependent on the hydration and temperature. These observations have led to the development of a “water shell” model to explain this phenomenon.|
|Rights:||This is the author's final draft of the paper published as IEEE International Conference on Solid Dielectrics, 2007 - Proceedings of, pp. 389-392. Copyright © 2007 IEEE. The final version is available from http://ieeexplore.ieee.org/. Doi: 10.1109/ICSD.2007.4290834. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Leicester’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to firstname.lastname@example.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.|
|Appears in Collections:||Conference Papers & Presentations, Dept. of Engineering|
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