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Title: Influence of thermal treatment and residues on space charge accumulation in XLPE for DC power cable application
Other Titles: The Influence of Material Modification and Residues on Space Charge Accumulation in XLPE for DC Cable Application (title of author's final draft).
Authors: Fu, Mingli
Chen, George
Dissado, Len A.
Fothergill, John C.
First Published: Feb-2007
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Citation: IEEE Transactions on Dielectrics and Electrical Insulation, 2007, 14 (1), pp. 53-64.
Abstract: Effects of cross-linking by-products (residues) of polyethylene on space charge accumulation and decay are investigated in the paper using the pulsed electro-acoustic technique. Space charge profiles have shown a great variation both in the charge initiation over the voltage ramping up process and later on long term stressing and decay (volts off) among the samples subjected to different conditioning, which results in diverse residues content (fresh, 0.5% residue and thoroughly degassed). The results show that by-products of cross-linking or the residual impurities play a key role in the space charge accumulation in cross-linked polyethylene. On the removal of impurities by degassing, small homocharge was built up in the vicinity of the electrode. It is concluded that space charge accumulation is governed by the charge injection through dielectric/electrode interface when sample is thoroughly degassed.
DOI Link: 10.1109/TDEI.2007.302872
ISSN: 1070-9878
Type: Article
Rights: This is the author's final draft of the paper published as IEEE Transactions on Dielectrics and Electrical Insulation, 2007, 14 (1), pp. 53-64. Copyright © 2007 IEEE. The final version is available from Doi: 10.1109/TDEI.2007.302872. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Leicester’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
Appears in Collections:Published Articles, Dept. of Engineering

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