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|Title:||Influence of absorbed water on the dielectric properties and glass-transition temperature of silica-filled epoxy nanocomposites.|
Fothergill, John C.
Rowe, Stephen W.
|Publisher:||Institute of Electrical and Electronics Engineers (IEEE)|
|Citation:||IEEE Conference on Electrical Insulation and Dielectric Phenomena, 2006 - Proceedings of, pp. 4-7|
|Abstract:||Work on dielectric spectroscopy of epoxy resin filled with nano-SiO2 at different relative humidities and temperatures is reported. Above the glass-transition temperature (Tg), dc-like imperfect charge transport (QDC or LFD) dominates the low frequency dielectric spectrum. Another mid-frequency relaxation process was found in the non-dried composites. Water also induces glass-transition temperature decreases, which can be measured both by dielectric spectroscopy and DSC. Both theory and experiment demonstrated that a higher water content could exist in nanocomposites than unfilled epoxy suggesting a bigger free volume when nanostructured. In our system, the hydrophilic surface of silica is likely to cause water to surround and lead to delamination of the epoxy from SiO2. This is a potential mechanical and dielectric weakness in the nanocomposites, which may lead to an ageing phenomenon. Hydrophobic surface group may reduce the water adsorption in nanocomposites.|
|Rights:||This is the author's final draft of the paper published as IEEE Conference on Electrical Insulation and Dielectric Phenomena, 2006 - Proceedings of, pp. 4-7. Copyright © 2006 IEEE. The final version is available from http://ieeexplore.ieee.org/. Doi: 10.1109/CEIDP.2006.311934. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Leicester’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to firstname.lastname@example.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.|
|Appears in Collections:||Conference Papers & Presentations, Dept. of Engineering|
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