Please use this identifier to cite or link to this item: http://hdl.handle.net/2381/4026
Title: Application of thermoelectric aging models to polymeric insulation in cable geometry
Authors: Cooper, Elizabeth S.
Dissado, Len A.
Fothergill, John C.
First Published: Feb-2005
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Citation: IEEE Transactions on Dielectrics and Electrical Insulation, 2005, 12 (1), pp. 1-10.
Abstract: The life expressions of models of insulation ageing are functions of temperature and field as well as material parameters. A methodology is presented that allows these models to be applied to a cable geometry in which there is a radial variation of both field and temperature. In this way material parameters can be extracted from cable data. The methodology is illustrated using one such model and the parameters deduced from cable failure distributions are compared with those obtained for thin films. This comparison allows conclusions to be drawn about how the ageing process affects specimens of the same material with different volumes.
DOI Link: 10.1109/TDEI.2005.1394009
ISSN: 1070-9878
Links: http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=1394009
http://hdl.handle.net/2381/4026
Type: Article
Rights: This is the author's final draft of the paper published as IEEE Transactions on Dielectrics and Electrical Insulation, 2005, 12 (1), pp. 1-10. Copyright © 2005 IEEE. The final version is available from http://ieeexplore.ieee.org/. Doi: 10.1109/TDEI.2005.1394009. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Leicester’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
Appears in Collections:Published Articles, Dept. of Engineering

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