Please use this identifier to cite or link to this item: http://hdl.handle.net/2381/40540
Title: Analysis of Electrical Tree Inception in Silicone Gels
Authors: Mancinelli, Paolo
Cavallini, Andrea
Dodd, Stephen J.
Chalashkanov, Nikola M.
Dissado, Leonard A.
First Published: 2017
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Citation: IEEE Transactions on Dielectrics and Electrical Insulation, 2017, In Press
Abstract: This work assesses the initial and crucial part of electrical treeing degradation, the inception stage, focusing on its dependence on applied voltage waveform and frequency. Tests have been performed on needle-plane configuration samples in solids and gels. A physical model has been formulated through an adaptation of an established theory for solids in which electrical tree inception is related to damage-producing injection currents. The voltage rise time appeared to be the most important parameter influencing the tree inception in the gel, while in the solid material the frequency is more relevant. The analysis leads to the conclusion that tree inception in gels is due to a single highenergy event, in contrast to what is commonly known for solids where damage accumulation takes place. A tree inception model is proposed for the gel, in which initiation is driven by a pressure wave generated by the electric field and the space charge injected into the sample. The model fits the experimental data and may be used to predict the tree initiation for different waveforms and voltage values.
DOI Link: TBA
ISSN: 1070-9878
Links: TBA
http://hdl.handle.net/2381/40540
Embargo on file until: 1-Jan-10000
Version: Post-print
Status: Peer-reviewed
Type: Journal Article
Rights: Copyright © 2017, Institute of Electrical and Electronics Engineers (IEEE). Deposited with reference to the publisher’s open access archiving policy.
Description: The file associated with this record is under embargo until publication, in accordance with the publisher's self-archiving policy. The full text may be available through the publisher links provided above.
Appears in Collections:Published Articles, Dept. of Engineering

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