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|Title:||The influence of physical and chemical linkage on the properties of nanocomposites.|
Nelson, J. Keith
Schadler, L. S.
Fothergill, John C.
|Publisher:||Institute of Electrical and Electronics Engineers (IEEE)|
|Citation:||Electrical Insulation and Dielectric Phenomena, 2005. CEIDP '05. 2005 Annual Report Conference on, 16-19 Oct. 2005 pp. 183-186.|
|Abstract:||It has been shown by several groups that the mechanical and electrical behavior of composites changes quite substantially, and often beneficially, when the filler particle size is less than 100 nm in diameter. There is also good reason to believe that the interface between the embedded particulates and the polymer matrix holds the key to understanding the bulk phenomena observed. Materials based on an SiO2-polyolefin system have been formulated with functionalized particulates so as to affect the physical and chemical linkages. The agents used to achieve this include amino-silane, hexamethyl-disilazane and triethoxyvinylsilane. The emerging picture of the interface is supported by detailed dielectric spectroscopy and internal space charge assessment. The nature of the internal structure has been related to the bulk properties observed such as the breakdown strength, voltage endurance, and the measurement of internal charges resulting from interfacial polarization.|
|Rights:||This is the author's final draft of the paper published as Annual Report of the Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, 2005, pp. 183-186. Doi: 10.1109/CEIDP.2005.1560651. Copyright © 2005 IEEE. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of the University of Leicester’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to firstname.lastname@example.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.|
|Appears in Collections:||Conference Papers & Presentations, Dept. of Engineering|
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