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|Title:||Electropolishing of nickel and cobalt in deep eutectic solvents|
|Authors:||Karim, Wrya O.|
Abbott, Andrew P.
Ryder, Karl S.
|Publisher:||Taylor & Francis for Institute of Metal Finishing|
|Citation:||Transactions of the Institute of Metal Finishing, 2018, 96 (4), pp. 200-205|
|Abstract:||Electropolishing is a common method for decreasing surface roughness and removing surface irregularities. In this paper the electropolishing of nickel and cobalt are successfully demonstrated in a deep eutectic solvent, comprising a 2:1 molar mixture of ethylene glycol and choline chloride. Voltammetric and electrochemical impedance studies were used to characterise the polishing mechanism and show that film formation occurs prior to polishing. Scanning electron microscopy and atomic force microscopy were used to characterise the morphology before and after polishing and 3D optical microscopy was used in-situ to observe film formation during polishing. This study shows that the impact of film formation and subsequently mass transport are responsible for electropolishing of both metals in the choline chloride-based ionic liquid.|
|Embargo on file until:||18-Jul-2019|
|Rights:||Copyright © 2018 Institute of Materials Finishing Published by Taylor & Francis on behalf of the Institute. Deposited with reference to the publisher’s open access archiving policy. (http://www.rioxx.net/licenses/all-rights-reserved)|
|Description:||The file associated with this record is under embargo until 12 months after publication, in accordance with the publisher's self-archiving policy. The full text may be available through the publisher links provided above.|
|Appears in Collections:||Published Articles, Dept. of Chemistry|
Files in This Item:
|Abbott Ni and Co polish TIMF final.pdf||Post-review (final submitted author manuscript)||1.34 MB||Adobe PDF||View/Open|
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