Please use this identifier to cite or link to this item: http://hdl.handle.net/2381/8730
Title: Design of a micromanipulation system for high temperature operation in an Environmental Scanning Electron Microscope (ESEM)
Authors: Samara-Ratna, P.
Atkinson, Helen V.
Stevenson, T. S.
Hainsworth, S. V.
Sykes, J.
First Published: 5-Dec-2006
Publisher: Institute of Physics
Citation: Journal of Micromechanics and Microengineering, 2007, 17 (1), pp. 104-114
Abstract: The Environmental Scanning Electron Microscope (ESEM) allows the sample to be imaged under a low pressure atmosphere. The ability to micromanipulate with precision within heated power systems in an ESEM will enable a greater understanding of the behaviour of materials at high temperature. Heating stages for ESEM’s are commercially available but none include micromanipulation systems. Creating such a system is fraught with design problems. This is because the piezoelectric transducers, required to generate the precise range of movement within the heated environment, are unable to operate at temperatures exceeding about 90°C and require thermal protection. Here we have used a one dimensional probe as a model of a three dimensional manipulator. We have introduced a thermal break and a thermally insulating extension arm to protect the piezoelectric from heat. We have applied finite element analysis to test the design concepts before practical implementation. This ensures that the piezoelectric transducers in the costly practical devices are not placed at risk. The predictions have been validated with subsequent experimental work although there are some discrepancies to resolve. An example of the movement of aluminium alloy grains and copper powder particles using the one-dimensional manipulator are given.
DOI Link: 10.1088/0960-1317/17/1/014
ISSN: 0960-1317
Links: http://iopscience.iop.org/article/10.1088/0960-1317/17/1/014/meta
http://hdl.handle.net/2381/8730
Type: Article
Rights: This is the author’s final draft of the paper published as Journal of Micromechanics and Microengineering, 2007, 17 (1), pp. 104-114. The final published version is available at http://iopscience.iop.org/0960-1317/17/1/014, Doi: 10.1088/0960-1317/17/1/014.
Appears in Collections:Published Articles, Dept. of Engineering

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