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Title: Crystallographically Faceted Void Formation in the Matrix of Lead-Free Solder Joints
Authors: Belyakov, S.
Atkinson, Helen V.
Gill, S. P. A.
First Published: 2-Apr-2010
Publisher: Springer Verlag
Citation: Journal of Electronic Materials, 2010, 39 (8), pp. 1295-1297
Abstract: Crystallographically faceted void (CFV) formation in lead-free solder joints has been observed after solidification and during subsequent solid-state aging. Such voids have not previously been reported in the literature. This paper gives a preliminary report on observations of voids which tend to be associated with, and adjacent to, intermetallic compounds in the solder bulk and near-substrate interface region. It has been observed that CFVs are correlated with β-Sn crystallographic orientation and form in a tetragonal shape. Aging promotes CFV clustering and growth.
DOI Link: 10.1007/s11664-010-1184-6
ISSN: 0361-5235
Type: Article
Description: This is the author’s final draft of the paper published as Journal of Electronic Materials, 2010, 39 (8), pp. 1295-1297. The original publication is available at, Doi: 10.1007/s11664-010-1184-6.
Appears in Collections:Published Articles, Dept. of Engineering

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