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|Title:||Ozone Cracking of Seals in Microchip Production|
Hainsworth, Sarah V.
|Publisher:||Society of Plastics Engineers|
|Citation:||ANTEC 2005: Annual Technical Conference, May 1-5, Hynes Convention Center, Boston, Massachusetts, Proceedings of the annual technical conference and exhibition of the Society of Plastics Engineers, pp. 3452-3459.|
|Abstract:||Lithography machines for making semiconductor chips use pneumatic circuits for the air bearings which support the tables on which the chips are etched by laser beams. The tables must be absolutely flat and perfectly still to achieve accurate circuits, a function achieved by the air bearings. An air bearing consists of a pressurised chamber enclosed by a nitrile rubber diaphragm. There have been problems however, with ozone cracking of the diaphragm seals, causing extensive machine downtime and loss of chip production. Examination of failed seals showed that very low levels of ozone (ppb) were sufficient to initiate cracks at sharp corners in the seal, the cracks growing until the seal failed. ESEM analysis of the fracture surface showed enhanced oxygen levels from traces of carbonyl compounds on the surface left by ozone attack. The problem has been eliminated by filtering the air flow both before and after the compressors.|
|Description:||This paper was published as ANTEC 2005: Annual Technical Conference, May 1-5, Hynes Convention Center, Boston, Massachusetts, Proceedings of the annual technical conference and exhibition of the Society of Plastics Engineers, pp. 3452-3459. It is available from http://www.4plasticsresearch.com/abstract.php?id=2005-100999.pdf&type=hitlist&num=0|
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|Appears in Collections:||Conference Papers & Presentations, Dept. of Engineering|
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